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3M 100-008-051

100-008-051

Manufacturer: 3M
CONN IC DIP SOCKET 8POS GOLD
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Specifications
Number of Positions or Pins (Grid) 8 (2 x 4)
Contact Material - Mating Beryllium Copper
Operating Temperature -65°C ~ 125°C
Features Closed Frame, Seal Tape
Contact Finish Thickness - Mating 8.00µin (0.203µm)
Termination Solder
Contact Finish - Post Gold
Contact Finish - Mating Gold
Dielectric Material Polyphenylene Sulfide (PPS), Glass Filled
Contact Finish Thickness - Post Flash
Contact Material - Post Brass
Pitch - Post 0.100" (2.54mm)
Pitch - Mating 0.100" (2.54mm)
Mounting Type Through Hole
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Type DIP, 0.3" (7.62mm) Row Spacing

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