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3M 100-008-051

    100-008-051

    Category:
    Manufacturer:3M
    CONN IC DIP SOCKET 8POS GOLD
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    Price: On request
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    Specifications
    Number of Positions or Pins (Grid)8 (2 x 4)
    Contact Material - MatingBeryllium Copper
    Operating Temperature-65°C ~ 125°C
    FeaturesClosed Frame, Seal Tape
    Contact Finish Thickness - Mating8.00µin (0.203µm)
    TerminationSolder
    Contact Finish - PostGold
    Contact Finish - MatingGold
    Dielectric MaterialPolyphenylene Sulfide (PPS), Glass Filled
    Contact Finish Thickness - PostFlash
    Contact Material - PostBrass
    Pitch - Post0.100" (2.54mm)
    Pitch - Mating0.100" (2.54mm)
    Mounting TypeThrough Hole
    Housing MaterialPolyphenylene Sulfide (PPS), Glass Filled
    TypeDIP, 0.3" (7.62mm) Row Spacing

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